Capability list
Parameter | Standard production | On request |
---|---|---|
Products | 1-28L PCB, FLEX, FLEX-RIGID, | |
Input Data Formats | Gerber, Excellon, Sieb&Mayer, ODB++ | DXF, HPGL |
basic material | FR4, Rogers RO4350B, IS400, IS410, P96, Polyimid, IMS |
Teflon, IS620....... |
No. of Conductive Layers Rigid | 1 -28 | |
RIGID FR4 Laminate Thickness in Stock | table of basic material | other thickness on request |
FLEXIBLE Material Thickness | 25, 50, 75, 100 and 125µm | |
Cu foil Thickness | 9µm, 18µm, 35µm, 70µm and 105µm | 150µm and 210µm |
Maximum PCB Size ( 1S, 2S and ML ) | 400x520mm | 500x600mm |
Min. PCB Thickness | 2-layer - 0,1mm 4-layer - 0,3mm 6-layer - 0,5mm 8-layer - 0,7mm |
2-layer - 0,07mm |
Max. PCB Thickness | 3,2mm | 5mm |
Min. T/G/Annular Ring | 0,12 / 0,12mm | 0,1 / 0,1mm |
Min. drilled Hole | 0,2mm | 0,1mm |
Max. drilled Hole | 6,4mm | over 6,4mm routed |
Blind and Burried Vias | Yes, BLV 1:1, Burried Vias Plugged | |
Plated Slots | 1,0mm and bigger, Controlled Depth | 0,6 - 1,0mm |
Smallest Routing Tool | 1,0mm | 0,6 - 1,0mm |
Routing Tolerance | 0,1mm | 0,1mm |
V-scoring | material 0,5 - 3,2mm, JUMP V-scoring | |
V-scoring Positioning Tolerance | +/-0,1mm in relation to drill | |
Photoimageable Soldermask | green | Blue, Red, Yellow, White, Bring White, Clack, HTg Resistant |
Soldermask for FPC | Photoimageable Green or Amber, PI foil ( Coverlay ) |
Photoimageable Black |
Peelable Mask | yes, blue | |
Marking Print | white | Blue, Red, Yellow, Black |
Min. Marking Print Line Size | 0,12mm | 0,1mm |
Carbon paste | Yes | |
Surface Protection Procces | H.A.S.L. : 6 - 8µm imersion Au : 4µm Ni / 0,09µm Au imersion Sn : 1 - 1,2µm galvanic Au ( Up to Size 100x300mm ) : 5µm Ni / 1µm Au |
OSP and other |
Galvanic Au | Yes | |
Production Times | standard : 10 working days expres : 1 - 9 working days |
|
Testing | 100% E-test Flying Probe, Optical AOI | |
Minimal order quantity | from 1pc | |
Maximal order quantity | on request |
Technology classification
Classification | A | B | C | D | X |
---|---|---|---|---|---|
Minimum track/gap thickness | 0,200 mm | 0,150 mm | 0,125 mm | 0,100 mm | 0,075 mm |
Minimum annular ring for class 2 - outer layers | 0,150 mm | 0,150 mm | 0,125 mm | 0,100 mm | 0,075 mm |
Minimum annular ring for class 2 - inner layers | 0,175 mm | 0,175 mm | 0,150 mm | 0,125 mm | 0,100 mm |
Minimum annular ring for class 3 - outer layers | 0,200 mm | 0,200 mm | 0,175 mm | 0,150 mm | --- |
Minimum annular ring for class 3 - inner layers | 0,225 mm | 0,225 mm | 0,200 mm | 0,175 mm | --- |
Minimum distance of PTH hole to copper | 0,325 mm | 0,325 mm | 0,265 mm | 0,225 mm | 0,200 mm |
Minimum drill diameter on 1,5mm board - through holes | 0,350 mm | 0,350 mm | 0,300 mm | 0,200 mm | 0,150 mm |
Minimum drill diameter on 1,5mm board - blind vias (max 1:1) | 0,300 mm | 0,300 mm | 0,200 mm | 0,150 mm | 0,100 mm |
Minimum drill diameter on 1,5mm board - Aspect ratio of THT vias | 1:4 | 1:5 | 1:6 | 1:8 | 1:10 |
Soldermask - minimum openings | 0,100 mm | 0,100 mm | 0,075 mm | 0,050 mm | 0,035 mm |
Soldermask - minimum bridge | 0,150 mm | 0,125 mm | 0,120 mm | 0,100 mm | 0,080 mm |
Soldermask - minimum thickness on conductor | 0,015 mm | 0,015 mm | 0,015 mm | 0,015 mm | 0,015 mm |
Minimum distance of conductor from board edge - routed board | 0,300 mm | 0,300 mm | 0,200 mm | 0,200 mm | 0,150 mm |
Minimum distance of conductor from board edge - routed board | 0,500 mm | 0,500 mm | 0,400 mm | 0,400 mm | --- |
***Valid for 18um copper. For thicker copper, clasification is shifted to left for each thickness (18/35/50/70um)
*** Clasification X-ADV is possible only after data check from PragoBoard
1 Final hole diameter
Smallest tracks/gaps and annular ring for different copper thicknesses
Base CU | Outer track | Outer gap | Outer annularring | Inner track | Inner gap | Inner annularring |
---|---|---|---|---|---|---|
9 µm | 0,075 mm | 0,075 mm | 0,075 mm | 0,075 mm | 0,075 mm | 0,075 mm |
12 µm | 0,075 mm | 0,075 mm | 0,075 mm | 0,075 mm | 0,075 mm | 0,100 mm |
18 µm | 0,100 mm | 0,100 mm | 0,100 mm | 0,100 mm | 0,100 mm | 0,125 mm |
35 µm | 0,150 mm | 0,125 mm | 0,125 mm | 0,125 mm | 0,125 mm | 0,150 mm |
50 µm | 0,200 mm | 0,175 mm | 0,150 mm | 0,150 mm | 0,150 mm | 0,175 mm |
70 µm | 0,250 mm | 0,200 mm | 0,150 mm | 0,200 mm | 0,200 mm | 0,175 mm |
105 µm | 0,300 mm | 0,250 mm | 0,200 mm | 0,300 mm | 0,250 mm | 0,200 mm |
140 µm | 0,350 mm | 0,300 mm | 0,250 mm | 0,350 mm | 0,300 mm | 0,250 mm |
210 µm | 0,500 mm | 0,450 mm | 0,250 mm | 0,500 mm | 0,450 mm | 0,250 mm |
400 µm | 0,800 mm | 0,800 mm | 0,250 mm | 0,800 mm | 0,800 mm | 0,250 mm |
Tolerances of production process
Tolerances of drilling, milling and v-cutting | |
---|---|
Drilling (PTH) to conductiove pattern outer layers | +-0,1 mm |
Drilling (PTH) to conductiove pattern inner layers | +-0,125 mm |
Drilling (PTH) to soldermask | +-0,1 mm |
Drilling (PTH) to silkscreen | +-0,15 mm |
Drilling (PTH) to routing | +-0,1 mm |
Drilling (NPTH) to routing | +-0,05 mm |
Drilling (PTH) to v-cutting | +-0,15 mm |
Drilling (NPTH) to v-cutting | +-0,15 mm |
Drilling to drilling (PTH-PTH or NPTH-NPTH) | +-0,05 mm |
Drilling to drilling (PTH-NPTH) | +-0,1 mm |
Routing to conductiove pattern | +-0,15 mm |
Milling z-axis | +-0,2 mm |
PTH diameter HAL | +-0,1 mm |
PTH diameter ENIG | +-0,1 mm |
NPTH diameter | +-0,1 mm |
V-cutting depth | +-0,2 mm |
Size of board | +-0,2 mm |
Tolerances of conductive pattern | |
---|---|
Conductive pattern to soldermask | +-0,05 mm |
Conductive pattern to silkscreen | +-0,15 mm |
Thinning of track thickness | max. 80% |
Thinning of gap thickness | max. 30% |
Tolerances of controlled impedances (if ordered) | +- 10% |
Layer-to-layer registration tolerance | +-75 µm |
Tolerances of boards | |
---|---|
Thickness of board | +-10% |
Bow & Twist | 0,75%* |
Number of boards delivered | -5/+10% |
* Only in case of balanced coppers pair layers and through board centre to max difference of 10% of copper surface and same copper thicknesses