Kapabilitet 2017-01-03T15:55:36+00:00

Capability list

Parameter Standard production On request
Products 1-28L PCB, FLEX, FLEX-RIGID,
Input Data Formats Gerber, Excellon, Sieb&Mayer, ODB++ DXF, HPGL
basic material FR4, Rogers RO4350B,
IS400, IS410, P96, Polyimid, IMS 		Teflon, IS620.......
No. of Conductive Layers Rigid 1 -28
RIGID FR4 Laminate Thickness in Stock table of basic material other thickness on request
FLEXIBLE Material Thickness 25, 50, 75, 100 and 125µm
Cu foil Thickness 9µm, 18µm, 35µm, 70µm and 105µm 150µm and 210µm
Maximum PCB Size ( 1S, 2S and ML ) 400x520mm 500x600mm
Min. PCB Thickness 2-layer - 0,1mm
4-layer - 0,3mm
6-layer - 0,5mm
8-layer - 0,7mm 		2-layer - 0,07mm
Max. PCB Thickness 3,2mm 5mm
Min. T/G/Annular Ring 0,12 / 0,12mm 0,1 / 0,1mm
Min. drilled Hole 0,2mm 0,1mm
Max. drilled Hole 6,4mm over 6,4mm routed
Blind and Burried Vias Yes, BLV 1:1, Burried Vias Plugged
Plated Slots 1,0mm and bigger, Controlled Depth 0,6 - 1,0mm
Smallest Routing Tool 1,0mm 0,6 - 1,0mm
Routing Tolerance 0,1mm 0,1mm
V-scoring material 0,5 - 3,2mm, JUMP V-scoring
V-scoring Positioning Tolerance +/-0,1mm in relation to drill
Photoimageable Soldermask green Blue, Red, Yellow, White,
Bring White, Clack, HTg Resistant
Soldermask for FPC Photoimageable Green or Amber,
PI foil ( Coverlay ) 		Photoimageable Black
Peelable Mask yes, blue
Marking Print white Blue, Red, Yellow, Black
Min. Marking Print Line Size 0,12mm 0,1mm
Carbon paste Yes
Surface Protection Procces H.A.S.L. : 6 - 8µm
imersion Au : 4µm Ni / 0,09µm Au
imersion Sn : 1 - 1,2µm
galvanic Au ( Up to Size 100x300mm ) :
5µm Ni / 1µm Au 		OSP and other
Galvanic Au Yes
Production Times standard : 10 working days
expres : 1 - 9 working days
Testing 100% E-test Flying Probe, Optical AOI
Minimal order quantity from 1pc
Maximal order quantity on request

Technology classification

Classification A B C D X
Minimum track/gap thickness 0,200 mm 0,150 mm 0,125 mm 0,100 mm 0,075 mm
Minimum annular ring for class 2 - outer layers 0,150 mm 0,150 mm 0,125 mm 0,100 mm 0,075 mm
Minimum annular ring for class 2 - inner layers 0,175 mm 0,175 mm 0,150 mm 0,125 mm 0,100 mm
Minimum annular ring for class 3 - outer layers 0,200 mm 0,200 mm 0,175 mm 0,150 mm ---
Minimum annular ring for class 3 - inner layers 0,225 mm 0,225 mm 0,200 mm 0,175 mm ---
Minimum distance of PTH hole to copper 0,325 mm 0,325 mm 0,265 mm 0,225 mm 0,200 mm
Minimum drill diameter on 1,5mm board - through holes 0,350 mm 0,350 mm 0,300 mm 0,200 mm 0,150 mm
Minimum drill diameter on 1,5mm board - blind vias (max 1:1) 0,300 mm 0,300 mm 0,200 mm 0,150 mm 0,100 mm
Minimum drill diameter on 1,5mm board - Aspect ratio of THT vias 1:4 1:5 1:6 1:8 1:10
Soldermask - minimum openings 0,100 mm 0,100 mm 0,075 mm 0,050 mm 0,035 mm
Soldermask - minimum bridge 0,150 mm 0,125 mm 0,120 mm 0,100 mm 0,080 mm
Soldermask - minimum thickness on conductor 0,015 mm 0,015 mm 0,015 mm 0,015 mm 0,015 mm
Minimum distance of conductor from board edge - routed board 0,300 mm 0,300 mm 0,200 mm 0,200 mm 0,150 mm
Minimum distance of conductor from board edge - routed board 0,500 mm 0,500 mm 0,400 mm 0,400 mm ---

***Valid for 18um copper. For thicker copper, clasification is shifted to left for each thickness (18/35/50/70um)
*** Clasification X-ADV is possible only after data check from PragoBoard
1 Final hole diameter

Smallest tracks/gaps and annular ring for different copper thicknesses

Base CU Outer track Outer gap Outer annularring Inner track Inner gap Inner annularring
9 µm 0,075 mm 0,075 mm 0,075 mm 0,075 mm 0,075 mm 0,075 mm
12 µm 0,075 mm 0,075 mm 0,075 mm 0,075 mm 0,075 mm 0,100 mm
18 µm 0,100 mm 0,100 mm 0,100 mm 0,100 mm 0,100 mm 0,125 mm
35 µm 0,150 mm 0,125 mm 0,125 mm 0,125 mm 0,125 mm 0,150 mm
50 µm 0,200 mm 0,175 mm 0,150 mm 0,150 mm 0,150 mm 0,175 mm
70 µm 0,250 mm 0,200 mm 0,150 mm 0,200 mm 0,200 mm 0,175 mm
105 µm 0,300 mm 0,250 mm 0,200 mm 0,300 mm 0,250 mm 0,200 mm
140 µm 0,350 mm 0,300 mm 0,250 mm 0,350 mm 0,300 mm 0,250 mm
210 µm 0,500 mm 0,450 mm 0,250 mm 0,500 mm 0,450 mm 0,250 mm
400 µm 0,800 mm 0,800 mm 0,250 mm 0,800 mm 0,800 mm 0,250 mm

Tolerances of production process

Tolerances of drilling, milling and v-cutting
Drilling (PTH) to conductiove pattern outer layers +-0,1 mm
Drilling (PTH) to conductiove pattern inner layers +-0,125 mm
Drilling (PTH) to soldermask +-0,1 mm
Drilling (PTH) to silkscreen +-0,15 mm
Drilling (PTH) to routing +-0,1 mm
Drilling (NPTH) to routing +-0,05 mm
Drilling (PTH) to v-cutting +-0,15 mm
Drilling (NPTH) to v-cutting +-0,15 mm
Drilling to drilling (PTH-PTH or NPTH-NPTH) +-0,05 mm
Drilling to drilling (PTH-NPTH) +-0,1 mm
Routing to conductiove pattern +-0,15 mm
Milling z-axis +-0,2 mm
PTH diameter HAL +-0,1 mm
PTH diameter ENIG +-0,1 mm
NPTH diameter +-0,1 mm
V-cutting depth +-0,2 mm
Size of board +-0,2 mm
Tolerances of conductive pattern
Conductive pattern to soldermask +-0,05 mm
Conductive pattern to silkscreen +-0,15 mm
Thinning of track thickness max. 80%
Thinning of gap thickness max. 30%
Tolerances of controlled impedances (if ordered) +- 10%
Layer-to-layer registration tolerance +-75 µm
Tolerances of boards
Thickness of board +-10%
Bow & Twist 0,75%*
Number of boards delivered -5/+10%

* Only in case of balanced coppers pair layers and through board centre to max difference of 10% of copper surface and same copper thicknesses